The phenolic urethane reaction causes byproducts to be emitted from molds as they cure. These emissions are thought to be linked to the physical property development of chemically bonded sand molds. The amount of emissions generated are typically measured using a weight loss technique developed by the Ohio Cast Metals... more

The phenolic urethane reaction causes byproducts to be emitted from molds as they cure. These emissions are thought to be linked to the physical property development of chemically bonded sand molds. The amount of emissions generated are typically measured using a weight loss technique developed by the Ohio Cast Metals Association (OCMA). However, this test cannot offer results on an individual mold basis as it was designed for laboratory use. Developments in low-cost sensor technology have provided a new avenue for measuring the time-based emission profiles from chemically bonded molds. In this study, a design of experiments approach was used to correlate the emissions and dew point as a function of time to the mechanical strength of phenolic urethane no-bake (PUNB) sand through multiple regression analysis. less